• Circuit Board Welding Thickness Measurement
  • Circuit Board Welding Thickness Measurement
  • Circuit Board Welding Thickness Measurement
  • Circuit Board Welding Thickness Measurement
  • Circuit Board Welding Thickness Measurement
  • Circuit Board Welding Thickness Measurement

Circuit Board Welding Thickness Measurement

After-sales Service: 1 Year
Warranty: 1 Year
Beam Color: Red
Horizontal Line: 1
Vertical Line: 1
Repeatability: <1μm
Customization:
Gold Member Since 2023

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Manufacturer/Factory

Basic Info.

Model NO.
TH-ink30
Accuracy
0.3μm
Measured Velocity
1000-2000 Times /S
Transport Package
Wooden Box Package
Specification
L*W*H=1670*1470*1950mm
Trademark
GIEZHY
Origin
Guangzhou China
HS Code
9015400000
Production Capacity
1000

Product Description

Circuit Board Welding Thickness Measurement

Measurement example

Circuit Board Welding Thickness Measurement


Circuit Board Welding Thickness Measurement
Circuit Board Welding Thickness Measurement
Circuit Board Welding Thickness Measurement
Product introduction:
    GIEZHY has introduced a non-contact thickness measuring instrument TH-20A, which uses a spectral confocal displacement sensor, a high precision operating table and a high resolution of up to nanometers. It can measure the thickness of mobile phone glass, film, white and transparent workpiece stably and accurately.

Spectral film thickness gauges are based on the principle of thin-film interference, a physical phenomenon in which light waves reflected from the upper and lower surfaces of a film interfere with each other, creating an interference of light that strengthens or weakens the reflected light. When white light, composed of a set of wavelengths, is incident on the film, certain wavelengths (colors) of light are enhanced while others are attenuated.
The interferogram produced by mixing two wavefronts is analyzed spectrographically to calculate the difference in their respective optical paths. When measuring thickness, two waves are generated by reflection from two faces of the transparent sample. In this case, the optical path difference is proportional to the thickness of the sample. The interference signal is a frequency spectrum. According to the phase of the spectrum of the signal, the sample thickness (or air layer gap) is calculated.

Main application:
PCB board coatings, semiconductor (silicon, monocrystalline silicon, polysilicon), semiconductor compounds, MEMS, oxides/nitrides, photoresist, hard coatings, polymer coatings, polymer polymers

Product advantage:
  Non-contact measurement, dry and wet conditions can be.
Super high resolution, up to danami level.
One key automatic measurement, automatic identification of glass, film thickness.
Transparent interlayers such as glass and film can be stably measured.
Technical parameter:
1,Probe 1: spectral confocal sensor probe

Sensor z-axis range ±550um  The range is optional
Sensor resolution 0.01um
Accuracy ±0.3um
Minimum measuring thickness 22 um
Maximum measuring thickness 1694 um
Repeatability <1μm
Probe operating distance 12.7mm
light spot size 12um
Lighting Blue laser excites wide spectrum white light


2,Probe 2: interference probe
Range (measureable thickness) 0.5-50um
Working distance 35mm
Angle ±5°
Spot size 0.1mm
Accuracy ±0.3μm
Resolution 0.01μm
Measured velocity 1000-2000 times /s





.Field use
Circuit Board Welding Thickness Measurement

Circuit Board Welding Thickness Measurement

 

 


Product introduction:
    GIEZHY has introduced a non-contact thickness measuring instrument TH-20A, which uses a spectral confocal displacement sensor, a high precision operating table and a high resolution of up to nanometers. It can measure the thickness of mobile phone glass, film, white and transparent workpiece stably and accurately.

Spectral film thickness gauges are based on the principle of thin-film interference, a physical phenomenon in which light waves reflected from the upper and lower surfaces of a film interfere with each other, creating an interference of light that strengthens or weakens the reflected light. When white light, composed of a set of wavelengths, is incident on the film, certain wavelengths (colors) of light are enhanced while others are attenuated.
The interferogram produced by mixing two wavefronts is analyzed spectrographically to calculate the difference in their respective optical paths. When measuring thickness, two waves are generated by reflection from two faces of the transparent sample. In this case, the optical path difference is proportional to the thickness of the sample. The interference signal is a frequency spectrum. According to the phase of the spectrum of the signal, the sample thickness (or air layer gap) is calculated.

Main application:
PCB board coatings, semiconductor (silicon, monocrystalline silicon, polysilicon), semiconductor compounds, MEMS, oxides/nitrides, photoresist, hard coatings, polymer coatings, polymer polymers

Product advantage:
  Non-contact measurement, dry and wet conditions can be.
Super high resolution, up to danami level.
One key automatic measurement, automatic identification of glass, film thickness.
Transparent interlayers such as glass and film can be stably measured.
Technical parameter:




Circuit Board Welding Thickness Measurement

Packaging & Transportation
Four protection + multiple protection
The volume weight of a single product is too large, and the volume will be large. If it is extra component a box of products, there are regulations, the weight should not exceed 20 to 25kg .and double-watt cartons can generally carry it. Packaging,especially  the outer box, has a certain function to protect the product . It has reasonable distribution in plug transportation,warehouse and tansportation to fully protect products.
Circuit Board Welding Thickness Measurement
Shipment
•In general, we use international express, DHL, UPS, FEDEX,EMS, TNT, etc.
•Large order: by air or sea, you chould choose it.
•If you have your own forwarder, please tell us the detailed infromation.
Circuit Board Welding Thickness Measurement

 

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